Enhanced security fingerprint sensor package and related methods

ABSTRACT

A fingerprint sensor package includes a tamper-resistant housing, a fingerprint sensor mounted in the housing, and an encryption output circuit mounted within the housing and operatively connected to the fingerprint sensor for generating an encrypted output signal related to a sensed fingerprint. The fingerprint sensor package may include a processor operatively connected between the fingerprint sensor and the encryption circuit. In addition, the package may also include a reference fingerprint memory for storing reference fingerprint information. Accordingly, the processor may have the capability to determine if a sensed fingerprint matches a stored reference fingerprint. To further enhance security of the stored reference fingerprint information, the sensor package also preferably includes a removing circuit or device for removing reference fingerprint information from the reference fingerprint storage means responsive to tampering. In one embodiment of the invention, the fingerprint sensor preferably includes an electric field integrated circuit fingerprint sensor. Method aspects of the invention are also disclosed.

FIELD OF THE INVENTION

The present invention relates to the field of personal identificationand verification, and, more particularly, to the field of fingerprintsensing and processing.

BACKGROUND OF THE INVENTION

Fingerprint sensing and matching is a reliable and widely used techniquefor personal identification or verification. In particular, a commonapproach to fingerprint identification involves scanning a samplefingerprint or an image thereof and storing the image and/or uniquecharacteristics of the fingerprint image. The characteristics of asample fingerprint may be compared to information for referencefingerprints already in storage to determine proper identification of aperson, such as for verification purposes.

A typical electronic fingerprint sensor is based upon illuminating thefinger surface using visible light, infrared light, or ultrasonicradiation. The reflected energy is captured with some form of camera,for example, and the resulting image is framed, digitized and stored asa static digital image. For example, U.S. Pat. No. 4,210,899 to Swongeret al. discloses an optical scanning fingerprint reader cooperating witha central processing station for a secure access application, such asadmitting a person to a location or providing access to a computerterminal. U.S. Pat. No. 4,525,859 to Bowles similarly discloses a videocamera for capturing a fingerprint image and uses the minutiae of thefingerprints, that is, the branches and endings of the fingerprintridges, to determine a match with a database of reference fingerprints.

Unfortunately, optical sensing may be affected by stained fingers or anoptical sensor may be deceived by presentation of a photograph orprinted image of a fingerprint rather than a true live fingerprint. Inaddition, optical schemes may require relatively large spacings betweenthe finger contact surface and associated imaging components. Moreover,such sensors typically require precise alignment and complex scanning ofoptical beams. Accordingly, optical sensors may thus be bulky and besusceptible to shock, vibration and surface contamination. Accordingly,an optical fingerprint sensor may be unreliable in service in additionto being bulky and relatively expensive due to optics and moving parts.

In the event of a failure to form an acceptable image of a fingerprint,U.S. Pat. No. 4,947,443 to Costello, for example, discloses a series ofindicator lights which give the user a simple go or no-go indication ofthe acceptability of the fingerprint scanning among other potentialsystem identification failures. In other words, another shortcoming ofconventional fingerprint sensors is that inaccurate positioning of thefinger relative to the sensor may reduce the ability of the processor toaccurately and quickly determine a match between a sample fingerprintand a plurality of reference fingerprints.

U.S. Pat. No. 4,353,056 to Tsikos discloses another approach to sensinga live fingerprint. In particular, the patent discloses an array ofextremely small capacitors located in a plane parallel to the sensingsurface of the device. When a finger touches the sensing surface anddeforms the surface, a voltage distribution in a series connection ofthe capacitors may change. The voltages on each of the capacitors isdetermined by multiplexor techniques. Unfortunately, the resilientmaterials required for the sensor may suffer from long term reliabilityproblems. In addition, multiplexing techniques for driving and scanningeach of the individual capacitors may be relatively slow and cumbersome.Moreover, noise and stray capacitances may adversely affect theplurality of relatively small and closely spaced capacitors.

U.S. Pat. No. 5,325,442 to Knapp discloses a fingerprint sensorincluding a plurality of sensing electrodes. Active addressing of thesensing electrodes is made possible by the provision of a switchingdevice associated with each sensing electrode. A capacitor iseffectively formed by each sensing electrode in combination with therespective overlying portion of the finger surface which, in turn, is atground potential. The sensor may be fabricated using semiconductor waferand integrated circuit technology. The dielectric material upon whichthe finger is placed may be provided by silicon nitride or a polyimidewhich may be provided as a continuous layer over an array of sensingelectrodes. Further conductors may be provided on the surface of thedielectric material remote from the sensing electrodes and extendingover regions between the sensing electrodes, for example, as lines or ingrid form, which conductors are grounded in order to improve theelectrical contact to the finger surface.

Unfortunately, driving the array of closely spaced sensing electrodes asdisclosed in the Knapp et al. patent may be difficult since adjacentelectrodes may affect one another. Another difficulty with such a sensormay be its ability to distinguish ridges and valleys of a fingerprintwhen the conductivity of the skin and any contaminants may vary widelyfrom person-to-person and even over a single fingerprint. Yet anotherdifficulty with such a sensor, as with many optical sensors, is thatdifferent portions of the fingerprint may require relatively complicatedpost image collection processing to provide for usable signal levels andcontrast to thereby permit accurate determination of the ridges andvalleys of the fingerprint.

Yet another shortcoming of conventional fingerprint sensors is that theleads and internal components of a conventional fingerprint sensor,either optical, ultrasonic or capacitive, may be tampered with, such asto send a false acceptance signal to an associated portion of equipment.Accordingly, even if the sensor is accurate and reliable, it may bereadily bypassed to gain access or entry to the equipment or areaintended to be protected by the fingerprint sensor.

Greater advances in fingerprint sensing and matching for identificationand verification are desirable and may prevent unauthorized use ofcomputer workstations, appliances, vehicles, and confidential data.Inexpensive and effective fingerprint identification may also be used atpoint-of-sale terminals, and ensure further security of credit and debitcards, firearms, and provide a personal electronic signature.Unfortunately, current sensors and their associated circuitry may be toobulky, expensive and unreliable for a great many applications whichwould otherwise benefit from fingerprint identification and verificationtechnology.

SUMMARY OF THE INVENTION

It is therefore an object of the present invention to provide afingerprint sensor and related methods for accurately sensing afingerprint, and which sensor is rugged, compact, reliable andrelatively inexpensive.

It is another object of the present invention to provide a securefingerprint sensing package or module and related methods for beingresistant to attempts at bypassing or tampering.

These and other objects, features and advantages of the presentinvention are provided in one embodiment by a fingerprint sensor packagecomprising a tamper-resistant housing, a fingerprint sensor mounted inthe housing, and encrypting output means mounted within the housing andoperatively connected to the fingerprint sensor for generating anencrypted output signal related to a sensed fingerprint. Accordingly,access to the interior of the package is deterred by the tamperresistant housing. Moreover, the encrypted output signal may not bereadily intercepted or otherwise bypassed.

The fingerprint sensor package may include a processor operativelyconnected between the fingerprint sensor and the encrypting outputmeans. In addition, the package may also include reference fingerprintstorage means for storing reference fingerprint information.Accordingly, the processor preferably comprises reference fingerprintmatching means for determining if a sensed fingerprint matches a storedreference fingerprint. To further enhance security of the storedreference fingerprint information, the sensor package also preferablyincludes removing means for removing reference fingerprint informationfrom the reference fingerprint storage means responsive to tampering.

In one embodiment of the invention, the fingerprint sensor preferablycomprises an integrated circuit having an outer surface portion forreceiving a finger adjacent thereto. The housing, in turn, preferablyincludes an opening therethrough in registry with the outer surfaceportion of the integrated circuit. Sealing means is preferably providedfor sealing an interface between the outer surface portion of theintegrated circuit and adjacent housing portions. The sealing means maybe provided by a bead of sealing material covering the interface. Thesealing means may also be provided by a hermetic seal formed between asurrounding layer of molded plastic material and adjacent portions ofthe integrated circuit.

The integrated circuit may comprise an outermost silicon nitride layerfor resistance to contamination, as from finger contact. In addition,the integrated circuit may have an outermost layer including one ofsilicon carbide and diamond for enhanced abrasion resistance.

For a high reliability, compact, relatively inexpensive, and ruggedsensor package, an electric field fingerprint sensor may be used. Moreparticularly, the electric field sensor preferably includes an array ofelectric field sensing electrodes, a dielectric layer adjacent theelectric field sensors, the dielectric layer for receiving a fingeradjacent thereto, and drive means for applying an electric field drivesignal to the electric field sensing electrodes and adjacent portions ofthe finger so that the electric field sensing electrodes produce afingerprint image signal.

One method aspect in accordance with the invention is for making andsecurely operating a fingerprint sensor package of a type including afingerprint sensor. The method preferably comprises the steps of:mounting the fingerprint sensor within a tamper-resistant housing, andgenerating within the tamper-resistant housing an encrypted outputsignal related to a sensed fingerprint from the fingerprint sensor. Themethod may also include the steps of: storing reference fingerprintinformation within the housing, and determining within thetamper-resistant housing if a sensed fingerprint matches a storedreference fingerprint. Accordingly, for further enhancement of security,the method may also include the step of removing reference fingerprintinformation from within the tamper-resistant housing responsive totampering.

Another method aspect in accordance with the invention is for making afingerprint sensor package including an integrated circuit fingerprintsensor. More particularly, the method preferably comprises the steps of:forming an integrated circuit fingerprint sensor having an upper surfacefor receiving a finger adjacent thereto, mounting the integrated circuitfingerprint sensor within a housing having an opening therethrough sothat the opening is in registry with the upper surface portion of theintegrated circuit, and sealing an interface between the upper surfaceportion of the integrated circuit and adjacent housing portions. Thestep of forming an integrated circuit fingerprint sensor preferablycomprises the step of forming an electric field fingerprint sensor.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of the fingerprint sensor in combinationwith a notebook computer in accordance with the present invention.

FIG. 2 is a schematic diagram of the fingerprint sensor in combinationwith a computer workstation and associated information processingcomputer and local area network (LAN) in accordance with the presentinvention.

FIG. 3 is a schematic perspective view of an embodiment of a fingerprintsensor in accordance with the invention.

FIG. 4 is a schematic plan view of a portion of the sensor and anoverlying fingerprint pattern in accordance with the present inventionwith a portion thereof greatly enlarged for clarity of illustration.

FIG. 5 is a greatly enlarged plan view of a portion of the fingerprintsensor in accordance with the invention with the upper dielectric layerremoved therefrom for clarity of illustration.

FIG. 6 is a schematic perspective view of a portion of the fingerprintsensor in accordance with the present invention.

FIG. 7 is a schematic fragmentary view of a portion of the fingerprintsensor in accordance with the present invention.

FIG. 8 is a schematic side view, partially in section, illustrating theelectric fields in accordance with the present invention.

FIG. 9 is a schematic circuit diagram of a portion of the fingerprintsensor in accordance with the present invention.

FIG. 10 is an enlarged schematic side view, partially in section,further illustrating the electric fields in accordance with the presentinvention.

FIG. 11 is a schematic block diagram of the fingerprint sensor andassociated circuitry in one embodiment in accordance with the presentinvention.

FIG. 12 is a schematic block diagram of the fingerprint sensor andassociated circuitry in another embodiment in accordance with thepresent invention.

FIG. 13 is a schematic block diagram of an embodiment of a sensorcircuit in accordance with the present invention.

FIG. 14 is a schematic block diagram of another embodiment of a sensorcircuit in accordance with the present invention.

FIG. 15 is a schematic block diagram illustrating a plurality of sensorunits in accordance with the present invention.

FIG. 16 is a schematic block diagram of an embodiment of a portion ofthe signal processing for the fingerprint sensor in accordance with thepresent invention.

FIG. 17 is a schematic block diagram of another embodiment of a portionof the signal processing for the fingerprint sensor in accordance withthe present invention.

FIG. 18 is a schematic block diagram of yet another embodiment of signalprocessing circuitry for the fingerprint sensor in accordance with thepresent invention.

FIG. 19 is a schematic circuit diagram of yet another embodiment of aportion of the signal processing for the fingerprint sensor inaccordance with the present invention.

FIG. 20 is a schematic circuit diagram of yet another embodiment of aportion of the signal processing for the fingerprint sensor inaccordance with the present invention illustrating a resistor matrix fordynamic contrast enhancement.

FIG. 21 is a schematic circuit diagram of yet another embodiment of aportion of the signal processing for the fingerprint sensor inaccordance with the present invention illustrating a capacitor matriximplementation for dynamic contrast enhancement.

FIG. 22 is a schematic block diagram of an embodiment of the fingerprintsensor package in accordance with the present invention.

FIG. 23 is a schematic diagram of another embodiment of the fingerprintsensor package in accordance with the present invention.

FIG. 24 is a schematic block diagram of another aspect of the sensor forillustrating near real-time positioning feedback of finger placement inaccordance with the invention.

FIG. 25 is a schematic perspective diagram of a computer illustratingnear real-time positioning feedback of finger placement in accordancewith the present invention.

FIG. 26 is a schematic perspective diagram of a fingerprint sensorincluding indicators for illustrating near real-time positioningfeedback of finger placement in accordance with the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention will now be described more fully hereinafter withreference to the accompanying drawings, in which preferred embodimentsof the invention are shown. This invention may, however, be embodied inmany different forms and should not be construed as limited to theembodiments set forth herein. Rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey the scope of the invention to those skilled in the art. Likenumbers refer to like elements throughout. The scaling of variousfeatures, particularly fingers and layers in the drawing figures, havebeen exaggerated for clarity of explanation.

Referring first to FIGS. 1-3, the fingerprint sensor 30 in accordancewith the invention is initially described. The illustrated sensor 30includes a housing or package 51, a dielectric layer 52 exposed on anupper surface of the package which provides a placement surface for thefinger, and a plurality of signal conductors 53. A conductive strip orelectrode 54 around the periphery of the dielectric layer 52 alsoprovides a contact electrode for the finger as described in greaterdetail below. The sensor 30 may provide output signals in a range ofsophistication levels depending on the level of processing incorporatedin the package as also described in greater detail below.

The fingerprint sensor 30 may be used in many different applications aswill be readily appreciated by those skilled in the art, such as forpersonal identification or verification purposes. For example, thesensor 30 may be used to permit access to a computer workstation, suchas a notebook computer 35 including a keyboard 36 and associated foldingdisplay screen 37 (FIG. 1). In other words, user access to theinformation and programs of the notebook computer 35 may only be grantedif the desired fingerprint is first sensed as also described in greaterdetail herein.

Another application of the fingerprint sensor 30 is illustrated withparticular reference to FIG. 2. The sensor 30 may be used to grant ordeny access to a fixed workstation 41 for a computer information system40. The system may include a plurality of such workstations 41 linked bya local area network (LAN) 43, which in turn, is linked to a fingerprintidentification server 43, and an overall central computer 44. Many otherapplications for the low cost and reliable electric field sensor 30 inaccordance with the invention are contemplated by the invention and willbe readily appreciated by those skilled in the art.

Referring now additionally to FIGS. 4-10, the sensor 30 is described ingreater detail. The sensor includes a plurality of individual pixels orsensing elements 30a arranged in array pattern as shown perhaps best inFIGS. 4 and 5. As would be readily understood by those skilled in theart, these sensing elements are relatively small so as to be capable ofsensing the ridges 59 and intervening valleys 60 of a typicalfingerprint (FIG. 4). As will also be readily appreciated by thoseskilled in the art, live fingerprint readings as from the electric fieldsensor in accordance with the present invention may be more reliablethan optical sensing, because the conduction of the skin of a finger ina pattern of ridges and valleys is extremely difficult to simulate. Incontrast, an optical sensor may be deceived by a readily preparedphotograph or other similar image of a fingerprint, for example.

The sensor 30 includes a substrate 65, and one or more activesemiconductive layers 66 thereon. A ground plane electrode layer 68 isabove the active layer 66 and separated therefrom by an insulating layer67. A drive electrode layer 71 is positioned over another dielectriclayer 70 and is connected to an excitation drive amplifier 74. Theexcitation drive signal may be typically in the range of about 1 Khz to1 Mhz and is coherently delivered across all of the array. Accordingly,the drive or excitation electronics are thus relatively uncomplicatedand the overall cost of the sensor 30 may be reduced, while thereliability is increased.

Another insulating layer 76 is on the drive electrode layer 71, and anillustratively circularly shaped sensing electrode 78 is on theinsulating layer 76. The sensing electrode 78 may be connected tosensing electronics 73 formed in the active layer 66 as schematicallyillustrated, and as would be readily appreciated by those skilled in theart.

An annularly shaped shield electrode 80 surrounds the sensing electrode78 in spaced relation therefrom. As would be readily appreciated bythose skilled in the art the sensing electrode 78 and its surroundingshield electrode 80 may have other shapes, such as hexagonal, forexample, to facilitate a close packed arrangement or array of pixels orsensing elements 30a. The shield electrode 80 is an active shield whichis driven by a portion of the output of the amplifier circuit 73 to helpfocus the electric field energy and, moreover, to thereby reduce theneed to drive adjacent electrodes. Accordingly, the sensor 30 permitsall of the sensing elements to be driven by a coherent drive signal insharp contrast to prior art sensors which required that each sensingelectrode be individually driven.

As understood with additional reference to FIGS. 8-10, the excitationelectrode 71 generates a first electric field to the sensing electrode78 and a second electric field between the sensing electrode 78 and thesurface of the finger 79, over the distances d1 and d2, respectively. Inother terms, a first capacitor 83 (FIG. 9) is defined between theexcitation electrode 71 and the sensing electrode 78, and a secondcapacitor 85 is defined between the finger skin 79 and ground. Thecapacitance of the second capacitor 85 varies depending on whether thesensing electrode 78 is adjacent a ridge or valley. Accordingly, thesensor 30 can be modeled as a capacitive voltage divider. The voltagesensed by the unity gain voltage follower or amplifier 73 will change asthe distance d2 changes.

In general, the sensing elements 30a operate at very low currents and atvery high impedances. For example, the output signal from each sensingelectrode 78 is desirably about 5 to 10 millivolts to reduce the effectsof noise and permit further processing of the signals. The approximatediameter of each sensing element 30a, as defined by the outer dimensionsof the shield electrode 80, may be about 0.002 to 0.005 inches indiameter. The excitation dielectric layer 76 and surface dielectriclayer 54 may desirably have a thickness in the range of about 1 μm. Theground plane electrode 68 shields the active electronic devices from theexcitation electrode 71. A relatively thick dielectric layer 67 willreduce the capacitance between these two structures and thereby reducethe current needed to drive the excitation electrode. The various signalfeedthrough conductors for the electrodes 78, 80 to the activeelectronic circuitry may be readily formed as would be understood bythose skilled in the art. In addition, the illustrated signal polaritiesmay be readily reversed as would also be readily understood by thoseskilled in the art.

The overall contact or sensing surface for the sensor 30 may desirablybe about 0.5 by 0.5 inches--a size which may be readily manufactured andstill provide a sufficiently large surface for accurate fingerprintsensing and identification. The sensor 30 in accordance with theinvention is also fairly tolerant of dead pixels or sensing elements30a. A typical sensor 30 includes an array of about 256 by 256 pixels orsensor elements, although other array sizes are also contemplated by thepresent invention. The sensor 30 may also be fabricated at one timeusing primarily conventional semiconductor manufacturing techniques tothereby significantly reduce the manufacturing costs.

Referring now additionally to FIG. 11, functional partitioning of anapparatus 90 including the fingerprint sensor 30 is described. Thefingerprint sensor apparatus 90 may be configured to provide one or moreof displacement sensing of the fingerprint, provide an image presenttrigger, perform analog-to-digital conversion, provide full imagecapture and image integrity determination, provide contrast enhancementand normalization, and provide image binarization. In the illustratedembodiment, the sensor 30 is connected to a parallel processor andmemory array 92, and control processor 93 via the illustrated interface91. The parallel processor 92 may provide image quality and bad blockdeterminations; provide edge enhancement and smoothing and thinning;generate ridge flow vectors, smooth the vectors and generate ridge flowcharacteristics as may be desired for fingerprint matching; identify thecenter of the fingerprint; generate, smooth and clean curves; andprovide minutiae identification. The illustrated control processor 93may provide minutiae registration and matching, minutiae storage,generate authorization codes, and communicate with the host via theillustrated interface 94. The illustrated local non-volatile memory 95may also be included in the apparatus 90.

A variation of the apparatus 90 of FIG. 11 is illustrated by theapparatus 100 of FIG. 12. This embodiment includes a two chip version ofthe sensor and processing electronics. The apparatus 100 includes asensor chip 96 and an authenticator chip 97 connected via a local memorybus interface 99. A scan control processor 98 is also included in theillustrated embodiment of FIG. 12, while the remaining functionalcomponents are the same as in FIG. 11 and need no further descriptionherein.

Demodulation and preliminary processing of the detected signals from thesensor 30 are further understood with reference to FIGS. 13 and 14. Bothof the illustrated circuits 110, 120 desirably use an alternatingcurrent excitation. In addition, the amplitude of the voltage on thesensor is proportional to the displacement of the local ground plane,hence, the signal has to be demodulated before further use. FIG. 13illustrates a local comparator 112 to allow the control to manage theA/D conversion process in parallel. The processor can present a sequenceof a reference voltages to an entire row or column of pixels or sensorelements 30a and monitor the transitions on the Sig0 lines. A successiveapproximation conversion could be implemented, first stepping largesteps, and then stepping in progressively finer steps over a smallerrange, as would be readily understood by those skilled in the art. TheSig0 output can be a binary bus connection while the SigA output is ademodulated analog signal that can be used as part of analog referencevoltage generating circuit, as would also be readily understood by thoseskilled in the art.

The circuit 120 illustrated in FIG. 14 has storage to do localizedcontrast enhancement for all sensor units or pixels simultaneously. Thecomputation can use the analog comparator 112 for a decision element.The binarized output image can be shifted out of the binary shiftregisters provided by the illustrated latches 113. Alternately, theoutput image could by read out as with conventional memory arrayaddressing as would be readily understood by those skilled in the art.Since the circuit 120 has its own local memory, it does not need aseparate set of buffers to store the pixel data.

Variations in skin conductivity and contamination may cause phase shiftof the electric field signal. Accordingly, the processing electroniccircuits 110, 120 of FIGS. 13 and 14 preferably include a synchronousdemodulator or detector 111 so that the overall circuit has lesssensitivity to any such variations in conductivity.

Interconnections of the sensor units or pixels 30a in a portion of anarray are schematically illustrated in FIG. 15. Column data transferlines 121, row data transfer lines 122, and comparator reference lines123 are shown connected to the array of sensor units 30a. Theinterconnections may be desirably made in an 8-by-8 block of sensorunits, although other configurations are also contemplated by thepresent invention.

Further embodiments of various processor circuitry is understood withreference to FIGS. 16 and 17. The circuit 130 of FIG. 16 includes acharge coupled device (CCD) shift register 131 which, in turn, includesa plurality of individual shift registers 135. The shift registers 131function as a tapped delay line to facilitate image signal processing.The registers 135 feed respective A/D converters 132 operated undercontrol of the illustrated block processor 134. The sensing amplifieroutputs are connected to the CCD analog shift registers 135, with oneshift register per row of pixels. A row of data is then shifted out ofthe register either to an A/D converter 132 which serves as the activeconversion device. Each pixel is converted to an 8 bit digital word asit arrives at the converter. The conversion process and the A-to-Dreference voltage are under control of block processors, where eachblock processor may control one or more rows, such as, for example, 16rows per each processor. A limited degree of dynamic contrastcompensation can be achieved using data from the previous pixelconversion to scale the reference voltage; however, significantdownstream digital image processing may still be required.

The circuit 140 of FIG. 17 is similar to that of FIG. 16. In FIG. 17, acomparator 141 operates under control of the illustrated block processor134 to provide the image output signals as would be readily understoodby those skilled in the art.

Turning now additionally to FIG. 18, another aspect of the signalprocessing configurations in accordance with the invention is described.This circuit embodiment 150 is similar to that embodiment illustrated inFIG. 11 and described above. The circuit 150 of FIG. 18 illustrativelyincludes a 16-by-16 array of sensor units or image cells 30b selectivelyaddressed and read by the illustrated row select data input multiplexor151, column select bus drivers 153, and comparator reference voltagedividers 152. Once an image has been captured from the electric fieldsensing electrodes and digitized, fingerprint features can be extractedfrom the image. FIG. 18 illustrates a high level view of a sensorconnected to a bank of digital signal processors 92. A 128×128 pixelarray, in this instance, has been partitioned into a 16×16 array ofimage cells 30b, wherein each image cell is formed of an 8×8 pixelarray.

Each image cell 30b has a single comparator reference line that servicesthe entire cell. When a cell 30b is being scanned, one of the parallelprocessors manages the reference voltage for that cell 30b and recordsthe digitized signals for all of the sensors in that cell. During theprocess of scanning the sensors in the cell 30b, the processor cansimultaneously correlate the data from the cell to generate apreliminary estimate of the ridge flow direction in that cell. In theillustrated embodiment, a control processor 93 manages the sensor signalscanning and digitization, and supervises a bank of parallel processors92 that perform feature extraction and matching functions. The otherillustrated components are similar to those discussed above withreference to FIG. 11 and, hence, need no further discussion.

Turning now additionally to FIG. 19, a 4×4 processor matrix circuit 180,such as might be used for a pipeline style implementation of thefingerprint minutiae processing, is illustrated. The circuit 180includes an array of processors 184, a sensor array input/output portion181, a non-volatile memory interface 182, and the illustratedmulti-processor array clock and control unit 182. The illustratedcircuit 180 may be used to identify and locate the fingerprint's uniqueminutiae to determine a match between a sensed fingerprint and one of aplurality of reference fingerprints. In other words, the processors 184may match the minutiae against a set of previously stored referenceminutia, to complete the identification process. When a positiveidentification has been made, for example, the circuit 180 may notify anexternal processor by sending an appropriately encrypted message over ahost processor interface.

There is a general need to ensure sufficient contrast between the ridgesand valleys of the fingerprint over the entire area of the fingerprint.The circuit 160 of FIG. 20 schematically illustrates a resistive networkor matrix 161 including a plurality of interconnected resistors 162 forproviding dynamic contrast enhancement for the array of pixels 30a. Theeffect of adjacent pixels is used to normalize the output of each pixeland while providing sufficient contrast. The circuit includes a pair ofamplifiers 163, 164 for providing the enhanced contrast output signals.

Each pixel's value is determined by comparing the sensor signal to areference signal that sums the block reference signal with a weightedaverage of the signals from all of the sensors in the immediate area.The square resistive grid or matrix provides the necessary weightedaverage to each of the pixel comparators simultaneously. The globalblock reference line 165 is preferably driven with a staircase waveformwhile the comparator outputs are monitored for change of state. Eachpixel's gray-scale value may be determined by noting which step of thestaircase causes that pixel's comparator to change state as would bereadily understood by those skilled in the art.

A variation for dynamic contrast enhancement is understood withreference to the circuit 170 of FIG. 21. Dynamic contrast enhancementcan also be implemented by an array 172 of capacitors 171interconnecting the pixel nodes 174. In this embodiment, the array 172receives an alternating current signal derived from the synchronousdemodulator 175 described in greater detail above. The capacitors 171serve as an AC impedance network distributing and averaging the ACsignals in a fashion analogous to the behavior of the resistive network161 (FIG. 20) for DC signals. In the AC contrast enhancing circuit 170,the lowpass filtering that in other embodiments may be part of thedemodulator circuit, is moved to the comparator 177 circuit portion. Thecapacitor array 172 is readily implemented using conventionalsemiconductor processing techniques and may offer an advantage ofrelatively small size as compared to the resistor array implementationdescribed above and as would be readily appreciated by those skilled inthe art.

The resistive matrix circuit 160 and capacitor matrix circuit 170 mayprovide weighting for image contrast enhancement. An alternative is toconduct such enhancement via downstream software which may take arelatively long time to fully process. Accordingly, the resistor matrixand capacitor matrix arrangement may provide greater overall processingspeed. In addition, such preliminary processing at the sensor 30 mayallow relaxation of A/D conversion from an 8 bit AD converter to a 1 bitconverter in some embodiments, while still providing high speed and at arelatively low cost. For example, processing of the fingerprint imageand determination of a match may desirably take only several seconds forcertain applications to avoid user frustration.

Referring now additionally to FIG. 22, another aspect of the inventionis described wherein the sensor 30 may be contained within a securesensor package 190. The sensor 30 is desirably mounted to preventflexing or shifting which may stress the chip or its electricalconnections. More particularly, the overall package may include a tamperresistant housing 191 as would be readily understood by those skilled inthe art. For example, the housing 191 may be formed of a hard plasticmaterial or metal that is strong and resistant to cutting, abrading orsawing. Alternately, the housing 191 may be a material which crumblesand destroys its internal circuit components if cutting, dissolution, orother forms of entry are attempted. Those of skill in the art willappreciate other variations of tamper resistant housings 191 ascontemplated by the present invention.

The sensor package 190 also includes the illustrated substrate 195,processor 192, destructible memory 195, and encrypted output circuit194. More particularly, the encrypted output circuit 194 provides anoutput signal that can only be decrypted by the intended downstreamdevice. Such encryption techniques will be readily understood by thoseskilled in the art and may include the use of various keys, passwords,codes, etc. as will also be readily understood by those skilled in theart. For example, U.S. Pat. Nos. 4,140,272; 5,337,357; 4,993,068 and5,436,972 each disclose various approaches to encryption and thedisclosures of these patents are incorporated herein in their entiretyby reference.

The output of the sensor package 190 may be communicated to associateddownstream decryption equipment via electrically conductive leads orpins, or may be inductively or optically coupled to associated equipmentas will be readily understood by those skilled in the art. As would alsobe understood by those skilled in the art, electrical or other types ofprotection may be provided on the encrypted output portion to ensurethat data, such as a database of fingerprints stored on the memory 193,is not readily readable by external connections and/or signalmanipulations.

The sensor 30 and processor 192 may be configured to provide any of arange of integral sensor processing features. For example, the encryptedoutput may be a raw image, a processed image, fingerprint minutiae data,a yes/no match indication, or personal identification and digitalsignature keys as would be readily understood by those skilled in theart.

The illustrated sensor package 190 also includes a bead 196 of sealingmaterial at the interface between the upper dielectric layer 52 of thesensor 30 and the adjacent portions of the housing 191. Other sealingarrangements are also contemplated by the present invention, fordesirably providing a fluid tight seal at the interface between theexposed upper dielectric layer and the adjacent housing portions. Inaddition, a cleaning liquid may be used to routinely clean the windowand reduce the contamination thereof. Since various alcohols, such asisopropyl alcohol are likely to be used as cleaning solutions, thehousing 191 and sealing bead 196 are desirably resistant to suchchemicals as would be readily understood by those skilled in the art.

Turning now additionally to FIG. 23 another sensor package 220 isillustrated, and the problems and solutions with respect to anintegrated circuit package in accordance with the present invention arediscussed. As would be readily understood by those skilled in the art, afingerprint sensor integrated circuit presents a special packagingdifficulty since it has to be touched by the finger being scanned. It istypically desired to avoid touching of an integrated circuit inconventional integrated circuit fabrication, in part, because ofpotential contamination. The main contaminants of concern are sodium andthe other alkaline metals. These contaminants may cause mobile ions inthe SiO₂ layers that are typically used to passivate the integratedcircuit. The resulting oxide charge degrades device characteristicsespecially in MOS technology.

One conventional approach to controlling mobile ionic contamination useshermetic packaging with a phosphorus-doped passivation layer over theintegrated circuit. The phosphorus doping reduces contaminant mobilityby trapping mechanisms as would be readily understood by those skilledin the art. Plastic packaging has now become more widespread, and asilicon nitride passivation layer may be used with the plasticpackaging. Silicon nitride may greatly reduce the permeability tocontaminants to permit direct contact between the finger of the user andthe integrated circuit. Accordingly, silicon nitride may preferably beused as a passivation layer of the fingerprint sensor in accordance withthe present invention.

A fingerprint sensor as in the present invention also raises severalunique packaging requirements including: the package needs to be open toenable finger-to-sensor die contact; the package should be physicallystrong in order to withstand rough use; the package and die should beable to withstand repeated cleaning with detergent and/or disinfectantsolutions, and including scrubbing; the die should be able to withstandcontact with a wide variety of organic and inorganic contaminants, andshould be able to withstand abrasion; and finally the package should berelatively inexpensive.

The illustrated package 220 of FIG. 23 addresses these packaging issues.The package 220 includes an integrated circuit die 221 mounted on ametal paddle 222 that is connected to the leadframe 223 during injectionmolding of the surrounding plastic material 191 of the package.Connections are made by bond wires 227 and the lead frame 223 to theoutwardly extending leads 228 as would be readily understood by thoseskilled in the art. The upper surface of the plastic housing 191includes an integrally molded opening 52 which permits contact to thedie 221. The adhesion between the plastic molding compound and theadjacent upper surface portions of the die creates a seal in thisillustrated embodiment. Accordingly, no separate sealing compound ormanufacturing step may be needed as would be readily understood by thoseskilled in the art.

The integrated circuit die 221 may also include a passivation layer 224of silicon nitride for reasons highlighted above. In addition, as shownin the illustrated sensor package 220, the die 221 may be provided witha second protective coating 225. Each of the coatings 224, 225 aredesirably relatively thin, such as on the order of about a micrometer,in order to retain sensor sensitivity. The outer coating 225 may be anorganic material, such as polyimide or PTFE (Teflon™) which yieldsadvantages in wear resistance and physical protection. Inorganiccoatings, such as silicon carbide or amorphous diamond, may also be usedfor the outer layer 225 and may greatly enhance wear resistance,especially to abrasive particles. In addition, the material of theprotective die coating 225 is preferably compatible with standard ICpattern definition methods in order to enable bond pad etching, forexample.

The bond pads on the integrated circuit die 221 may be provided byaluminum. Another perhaps more preferable approach seals the pads with agold plug, as may be applied by electroplating, as would be readilyunderstood by those skilled in the art. As would also be readilyunderstood by those skilled in the art, in order to reduce the heightcreated by the looped bond wires 227, the die 221 may be directlyflip-chip bonded in another embodiment of the invention, not shown. Aswould be readily understood by those skilled in the art, the sensorpackage 220 in other embodiments may be manufactured using tapeautomated bonding techniques.

Returning again briefly to FIG. 22, yet another aspect of the sensorpackage 190 is that the memory 198 and/or other integrated circuitcomponents may be made to destruct or be rendered secure upon breach ofthe housing 191, for example. A coating 193 of material may be appliedto the integrated circuit die(s) that causes destruction of the die ifthe coating is dissolved away as would be readily understood by thoseskilled in the art. The memory 193 may also self-destruct or empty itscontents upon exposure to light or upon removal of a sustainingelectrical current. Those of skill in the art will readily appreciateother approaches to ensuring the integrity of the data and processingcapabilities of the sensor package 190 in accordance with the presentinvention. Accordingly, the present invention provides that sensitivedata, such as a database of authorized fingerprints, encryption keys, orauthorization codes, are not readily stolen from the sensor package 190.In addition, although the sensor package 190 may desirably incorporatethe electrical field sensor 30 as described extensively herein, othersensors are also contemplated for inclusion with a secure sensor packagein accordance with this aspect of the invention.

The various embodiments of the sensor 30 and its associated processingcircuitry may implement any of a number of conventional fingerprintmatching algorithms. For example, a suitable fingerprint matchingalgorithm and indexing approach for quick and efficient searching isdescribed in copending patent application entitled "Methods and RelatedApparatus for Fingerprint Indexing and Searching", having attorney workdocket number 16872, having Ser. No. 08/589,064, assigned to theassignee of the present invention and the entire disclosure of which isincorporated herein by reference in its entirety.

As would be readily understood by those skilled in the art, fingerprintminutiae, that is, the branches or bifurcations and end points of thefingerprint ridges, are often used to determine a match between a sampleprint and a reference print database. Such minutiae matching may bereadily implemented by the processing circuitry of the present inventionas would be readily understood by those skilled in the art. For example,U.S. Pat. Nos. 3,859,633 and 3,893,080 both to Ho et al. are directed tofingerprint identification based upon fingerprint minutiae matching.U.S. Pat. No. 4,151,512 to Riganati et al., for further example,describes a fingerprint classification method using extracted ridgecontour data. U.S. Pat. No. 4,185,270 to Fischer II et al. discloses aprocess for encoding and verification also based upon minutiae. Inaddition, U.S. Pat. No. 5,040,224 to Hara discloses an approach topreprocessing fingerprints to correctly determine a position of the coreof each fingerprint image for later matching by minutiae patterns. Theentire disclosures of each of these U.S. patents are incorporated hereinby reference.

Turning now lastly to FIGS. 24-26 another significant aspect of thepresent invention is described. Because of the relatively fast andefficient processing of a fingerprint image provided by above identifiedsensor 30 and associated circuitry of the invention, the user may beprovided with nearly real-time feedback regarding positioning of hisfinger on a fingerprint sensor, such as the illustrated electric fieldsensor 30. Accordingly, the user may quickly and accurately repositionhis finger, have his identification accurately determined, and promptlymove forward with the intended task. In the past only a simple go orno-go indication has been described for a user as in U.S. Pat. No.4,947,443 to Costello, for example, and with such an indication mostlikely taking a relatively long time. It is generally understood thatunless such an indication can be given within several seconds, userfrustration is likely to rise dramatically with any further passage oftime. Moreover, a simple go/no-go indication may only prompt the user totry again without any useful guidance on what may be causing the no-goindication.

The apparatus 200 (FIG. 24) illustratively includes a fingerprint sensor30 operatively connected to an image processor 201. Along the lines asdiscussed above, the image processor 201 may include the tapped delayline or other functional center point calculator 202 for determining acenter point from the sensed fingerprint as will be readily appreciatedby those skilled in the art. The location of the center point relativeto a predetermined reference center point may be determined and anindication given the user via a position indicator 203. The image mayalso be further analyzed, and if the applied finger pressure is toogreat or too little, such an indication may also be given to the user.Accordingly, potential user frustration may be significantly reduced. Aneed to clean the sensor may also be effectively communicated to theuser if repositioning and/or pressure changes are ineffective, such asafter a predetermined number of attempts.

Turning now more particularly to FIG. 25, a practical implementation ofthe position feedback sensing and indication is further described asapplied in a computer workstation, such as the illustrated notebookcomputer 35 of the type including a keyboard 36 and display 37. Those ofskill in the art will recognize the applicability of this aspect of theinvention to many types of fixed and portable computer workstations inaddition to the illustrated notebook computer.

In the illustrated embodiment, the fingerprint sensor 30 receives thefinger of the user. The processor of the computer in cooperation withthe fingerprint sensor 30 generates a display of the fingerprint image206 along with its center point 205 on an image of a window 207 on thedisplay 37. In the illustrated embodiment, the display also includes atarget center point 208 to assist the user is repositioning his fingerfor an accurate reading.

In addition to the visual image indication, a further indication may begiven by display of the words "move upward" and "move left" along withthe illustrated associated directional arrows. An indication may also begiven concerning a desired pressure, such as the illustrated words"increase pressure".

Yet another variation of the feedback and pressure indications may be inthe form of synthetically generated speech messages issued from aspeaker 39 mounted within the housing of the computer. For example, thegenerated voice messages illustratively include an annunciation to "movefinger up and to the left" and "increase finger pressure". Other helpfulmessages are also contemplated by the present invention.

Still another embodiment of finger position feedback sensing andindication is understood with further reference to the apparatus 210 ofFIG. 26. In this embodiment, the sensor 30 is used to operate an accesscontroller 211 which, in turn, may operate a door, for example, topermit a properly identified user to enter. Simple visual indications inthe form of LEDs 212, 213 for up and down motion, and left and rightmotion, respectively, may be provided to indicate to the user the properpositioning or repositioning of his finger. The illustrated embodimentalso includes a plurality of LEDs 214 for indication of pressure. Thoseof skill in the art will readily appreciate many other variations andalternate embodiments of the feedback sensing and positioning inaccordance with this aspect of the present invention.

Many modifications and other embodiments of the invention will come tothe mind of one skilled in the art having the benefit of the teachingspresented in the foregoing descriptions and the associated drawings.Therefore, it is to be understood that the invention is not to belimited to the specific embodiments disclosed, and that modificationsand embodiments are intended to be included within the scope of theappended claims.

That which is claimed is:
 1. A fingerprint sensor package comprising:atamper-resistant housing having an opening therethrough; an integratedcircuit fingerprint sensor mounted in said housing, said integratedcircuit fingerprint sensor comprisingan integrated circuit die includingan array of electric field sensing electrodes thereon, a dielectriclayer adjacent said electric field sensing electrodes, said dielectriclayer defining an outer surface portion exposed through the opening forcontact by a finger of a user, and drive means for applying an electricfield drive signal to said electric field sensing electrodes andadjacent portions of the finger so that said electric field sensingelectrodes produce a fingerprint image signal; and encrypting outputmeans mounted within said housing and operatively connected to saidintegrated circuit fingerprint sensor for generating an encrypted outputsignal related to a sensed fingerprint; said tamper-resistant housingcomprising a body of encapsulating material surrounding andencapsulating said integrated circuit fingerprint sensor and saidencrypting output means, said body of encapsulating material beingintegrally molded and providing a sealing function with said integratedcircuit die adjacent the outer surface portion thereof.
 2. A fingerprintsensor package according to claim 1 further comprising a processoroperatively connected between said fingerprint sensor and saidencrypting output means.
 3. A fingerprint sensor package according toclaim 2 further comprising reference fingerprint storage means forstoring reference fingerprint information, and wherein said processorcomprises reference fingerprint matching means for determining if asensed fingerprint matches a stored reference fingerprint.
 4. Afingerprint sensor package according to claim 3 further comprisingremoving means for removing reference fingerprint information from saidreference fingerprint storage means responsive to tampering.
 5. Afingerprint sensor package according to claim 1 further comprisingsealing means for sealing an interface between the outer surface portionof the integrated circuit and adjacent housing portions.
 6. Afingerprint sensor package according to claim 5 wherein said sealingmeans comprises a bead of sealing material.
 7. A fingerprint sensorpackage according to claim 5 wherein said body of encapsulating materialcomprises a plastic material, and wherein sealing means comprises ahermetic seal between the plastic material and adjacent portions of theintegrated circuit.
 8. A fingerprint sensor package according to claim 4wherein said integrated circuit comprises an outermost silicon nitridelayer.
 9. A fingerprint sensor package according to claim 4 wherein saidintegrated circuit comprises an outermost layer including one of siliconcarbide and diamond.
 10. A fingerprint sensor package according to claim1 wherein said drive means comprises coherent drive means for applying acoherent electric field drive signal to said array of electric fieldsensing electrodes.
 11. A fingerprint sensor package according to claim1 further comprising a finger electrode exposed on an outer surface ofsaid housing.
 12. A fingerprint sensor package comprising:atamper-resistant housing having an opening therethrough; an integratedcircuit fingerprint sensor mounted in said housing, said integratedcircuit fingerprint sensor comprisingan integrated circuit die includingan array of electric field sensing electrodes thereon, a dielectriclayer adjacent said electric field sensing electrodes. said dielectriclayer defining an outer surface portion exposed through the opening forcontact by a finger of a user, and drive means for applying an electricfield drive signal to said electric field sensing electrodes andadjacent portions of the finger so that said electric field sensingelectrodes produce a fingerprint image signal; reference fingerprintstorage means positioned within said housing for storing referencefingerprint information; and a processor operatively connected to saidintegrated circuit fingerprint sensor and said reference fingerprintstorage means for determining if a sensed fingerprint matches a storedreference fingerprint; said tamper-resistant housing comprising a bodyof encapsulating material surrounding and encapsulating said integratedcircuit fingerprint sensor, said reference fingerprint storage means,and said processor, said body of encapsulating material being integrallymolded and providing a sealing function with said integrated circuit dieadjacent the outer surface portion thereof.
 13. A fingerprint sensorpackage according to claim 12 further comprising removing means forremoving reference fingerprint information from said referencefingerprint storage means responsive to tampering.
 14. A fingerprintsensor package according to claim 12 further comprising encryptingoutput means mounted within said housing and operatively connected tosaid processor for generating an encrypted output signal related to asensed fingerprint.
 15. A fingerprint sensor package according to claim12 further comprising sealing means for sealing an interface between theouter surface portion of the integrated circuit and adjacent housingportions.
 16. A fingerprint sensor package according to claim 15 whereinsaid sealing means comprises a bead of sealing material.
 17. Afingerprint sensor package according to claim 15 wherein said body ofencapsulating material comprises a plastic material, and wherein sealingmeans comprises a hermetic seal between the plastic material andadjacent portions of the integrated circuit.
 18. A fingerprint sensorpackage according to claim 12 wherein said integrated circuit comprisesan outermost silicon nitride layer.
 19. A fingerprint sensor packageaccording to claim 12 wherein said integrated circuit comprises anoutermost layer including one of silicon carbide and diamond.
 20. Afingerprint sensor package according to claim 12 wherein saiddrive meanscomprises coherent drive means for applying a coherent electric fielddrive signal to said array of electric field sensing electrodes.
 21. Afingerprint sensor package according to claim 12 further comprising afinger electrode exposed on an outer surface of said housing.
 22. Afingerprint sensor package comprising:a housing having an openingtherethrough; an integrated circuit fingerprint sensor mounted in saidhousing and comprisingan integrated circuit die including an array ofelectric field sensing electrodes thereon, a dielectric layer adjacentsaid electric field sensing electrodes, said dielectric layer definingan outer surface portion exposed through the opening for contact by afinger of a user, and drive means for applying an electric field drivesignal to said electric field sensing electrodes and adjacent portionsof the finger so that said electric field sensing electrodes produce afingerprint image signal; and encrypting output means mounted withinsaid housing and operatively connected to said integrated circuitfingerprint sensor for generating an encrypted output signal related toa sensed fingerprint; said housing comprising a body of encapsulatingmaterial surrounding and encapsulating said integrated circuitfingerprint sensor and said encrypting output means, said body ofencapsulating material being integrally molded and providing a sealingfunction with said integrated circuit die adjacent the outer surfaceportion thereof.
 23. A fingerprint sensor package according to claim 22further comprising a processor operatively connected between saidfingerprint sensor and said encrypting output means.
 24. A fingerprintsensor package according to claim 23 further comprising referencefingerprint storage means for storing reference fingerprint information,and wherein said processor comprises reference fingerprint matchingmeans for determining if a sensed fingerprint matches a stored referencefingerprint.
 25. A fingerprint sensor package according to claim 24further comprising removing means for removing reference fingerprintinformation from said reference fingerprint storage means responsive totampering.
 26. A fingerprint sensor package according to claim 22further comprising sealing means for sealing an interface between theouter surface portion of the integrated circuit and adjacent housingportions.
 27. A fingerprint sensor package according to claim 26 whereinsaid sealing means comprises a bead of sealing material.
 28. Afingerprint sensor package according to claim 26 wherein said body ofencapsulating material comprises a plastic material, and wherein sealingmeans comprises a hermetic seal between the plastic material andadjacent portions of the integrated circuit.
 29. A fingerprint sensorpackage according to claim 22 wherein said integrated circuit comprisesan outermost silicon nitride layer.
 30. A fingerprint sensor packageaccording to claim 22 wherein said integrated circuit comprises anoutermost layer including one of silicon carbide and diamond.
 31. Afingerprint sensor package according to claim 22 wherein saiddrive meanscomprises coherent drive means for applying a coherent electric fielddrive signal to said array of electric field sensing electrodes.
 32. Afingerprint sensor package according to claim 26 wherein said housing isa tamper-resistant housing.
 33. A fingerprint sensor package accordingto claim 26 further comprising a finger electrode exposed on an outersurface of said housing.
 34. A method for making and securely operatinga fingerprint sensor package of a type including an integrated circuitfingerprint sensor, the method comprising the steps of:forming anintegrated circuit fingerprint sensor comprising an integrated circuitdie, an array of electric field sensing electrodes on the integratedcircuit die, a dielectric layer adjacent said electric field sensingelectrodes defining an outer surface portion for receiving a fingeradjacent thereto, and drive means for applying an electric field drivesignal to said electric field sensing electrodes and adjacent portionsof the finger; mounting the integrated circuit fingerprint sensor withina tamper-resistant housing so that an outer surface portion of saidintegrated circuit die is exposed through an opening in the housing; andgenerating within the tamper-resistant housing an encrypted outputsignal related to a sensed fingerprint from the fingerprint sensor;wherein the step of mounting comprises integrally molding a body ofencapsulating material to surround and encapsulate the integratedcircuit fingerprint sensor so that the body of encapsulating materialprovides a sealing function with the integrated circuit die adjacent theouter surface portion thereof.
 35. A method according to claim 34further comprising the steps of:storing reference fingerprintinformation within the housing; and determining within thetamper-resistant housing if a sensed fingerprint matches a storedreference fingerprint.
 36. A method according to claim 35 furthercomprising the step of removing reference fingerprint information fromwithin the tamper-resistant housing responsive to tampering.